Improved FIB lamella preparation

DENSsolutions introduces the 3rd generation of the FIB stub which enables researchers to prepare a lamella and place it directly on the Nano-Chip, all inside the FIB. In this version, many improvements were made to make the FIB sample preparation easier, safer and quicker. Read the interview with Product Manager Dr. Yevheniy (Gin) Pivak who headed the development.

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